Samsung Electronics Co., Ltd., one of the leaders in advanced semiconductor technology, proudly announced that it has innovated the industry’s first thermally-enhanced and heat capable chip-on-film called the TECOF package for the display driver IC (DDI) used in large-screen, high-resolution LCD (liquid crystal displays) TVs. Demand for LCD TVs is rolling with increased convenience to digital broadcasting as well as transmission. At the same time, rapidly improving LCD TV performance has sparked explosive demand for full-high-definition models with a screen size of forty inches or larger.
A DDI requires at least 15 volts of power to constrain these larger, higher-resolution LCD TV panels that operate on broader frequency spectrums to reproduce high-speed video images. As a result, the DDI generates greater heat, which can create reliability problems.
Samsung has developed a new highly evasive material for the thin metal tape component that has the optimal properties for effectively taking full advantage of heat dissipation factors. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying Samsung’s new TECOF package, the thermal emissions as well as the radiations emitting from the DDI are quickly released via the metal tape, minimizing heat buildup in the vicinity and thus acting as a heat sink. The new DDI package improves thermal heat dissipation by 20 percent over a conformist COF package, thus effectively allowing the DDI to last longer and operate with greater reliability and flexibility.
In addition to this heat build-up limits the number of channels a single DDI chip can envelop, creating a barrier to reduce the total number of DDI per panel. With the new TECOF package, the number of source DDIs for a full-HD LCD TV is reduced from fourteen 414 channel-DDIs to eight 720 channel-DDIs, pretty cool thing.
No comments:
Post a Comment